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ASML TwinScan XT:1400F Refurbished
TwinScan XT:1400F DUV Lithography, The XT:1400F is a dual-stage ArF lithography system designed for 200mm and 300mm wafers at 65nm resolution.
JEOL JBX-3200MVS Electron Beam Lithography System
JBX-3200MVS is a variable-shaped electron beam lithography system for mask making of 32 nm to 28 nm nodes. Its advanced technology achieves high speed, high precision and high reliability. This EB system uses a variable-shaped 50 kV electron beam and a step-and-repeat specimen stage.
Tystar Tytan Mini LPCVD
Tytan Mini Furnace Systems are designed for diffusion, oxidation and LPCVD applications.
IL600 UP Machining Center
The IL600 is a four-axis or optional five-axis ultra-precision machining center that enables high-productivity optical product machining.
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Photomask (Reticle)
A photomask (also simply called a mask) is an opaque plate with transparent areas that allow light to shine through in a defined pattern. Photomasks are commonly used in photolithography for the production of integrated circuits (ICs or "chips") to produce a pattern on a thin wafer of material (usually silicon). In semiconductor manufacturing, a mask is sometimes called a reticle.
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2025.04.22
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2025.03.18
Potential of E-beam lithography for micro- and nano-optics fabrication on large areas
The availability of high-resolution and high-throughput lithographic fabrication technologies, such as electron-beam lithography, based on variable shaped beam writing and character projection opens the way for the flexible use of various optical nano-structures for some of the most demanding applications. We discuss the technical features, advantages, and limitations of these pattering approaches and show how they can favorably be combined to realize optical nano-structures for applications, which are as diverse as gratings for ultra-short laser pulses or high-resolution spectrometers, computer generated holograms for asphere testing, various optical meta-structures (lenses and gratings), or UV-polarizers.
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2025.04.17
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