ASML TWINSCAN Core Features

Double workpiece stage (TWINSCAN) technology

Synchronous operation: Two stages work in parallel, one for exposure, and the other for wafer alignment and measurement, greatly increasing production capacity (up to 200+ chips/hour).

High precision: Overlay accuracy can reach the nanometer level, ensuring accurate alignment of multilayer circuits.

Light source type and process node

Dry lithography: If using KrF (248nm) or i-line (365nm) light sources, it is suitable for mature processes (such as nodes of 180nm and above).

● Resolution: ~110-130nm (depending on process and mask technology).

● Overlay accuracy: <10nm.

● Production capacity: 150-200 wafers/hour (300mm wafers).

● Mature process chips and memory chips in application fields