Runsemi Single-Wafer Photomask Cleaning System Specifications

The system is equipped with a variety of cleaning processes, suitable for cleaning high-process mask plates such as BIN, PSM, and EUV Mask;

The system has excellent foreign matter removal performance and no pattern damage characteristics;

The liquid cleaning method uses SPM, SC1, O3W, and HDIW;

The cleaning methods include 1MHz~3MHz megasonic wave, two-fluid, and brush cleaning.

● Mask Size:                              6"（6025） ；

● Equipment Cleanliness:           ISO Class1 ；

● Cleaning Mode:   Double-Sided Cleaning；

● Node:                                           ≤14nm ；